Generally used with epoxy systems for wood bonding (WOODPOXY PLUS, SR 8450).
Excellent thickening and gap-filling properties for wood bonding surfaces and for high-density fillet joints; to be combined with Silicell to improve smoothness and thixotropy.
Generally used with epoxy systems for wood bonding (WOODPOXY PLUS, SR 8450).
Excellent thickening and gap-filling properties for wood bonding surfaces and for high-density fillet joints; to be combined with Silicell to improve smoothness and thixotropy.